US 12,243,911 B2
Integrated circuit package for isolation dies
Matthew David Romig, Allen, TX (US); Enis Tuncer, Dallas, TX (US); Rajen Manicon Murugan, Dallas, TX (US); and Yiqi Tang, Allen, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Sep. 10, 2020, as Appl. No. 17/017,642.
Claims priority of provisional application 62/945,679, filed on Dec. 9, 2019.
Prior Publication US 2021/0175326 A1, Jun. 10, 2021
Int. Cl. H01L 29/06 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 29/0642 (2013.01) [H01L 21/4825 (2013.01); H01L 21/4839 (2013.01); H01L 21/565 (2013.01); H01L 23/3135 (2013.01); H01L 23/49811 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An isolation device comprising:
an isolation die having bond pads;
a first lead frame having first leads, the isolation die being mounted on the first lead frame with a portion of the bond pads coupled to respective first leads;
first mold material encapsulating the isolation die and the first lead frame forming a first package;
a second lead frame having second leads, the first package being mounted on the second lead frame with a portion of the first leads coupled to respective second leads; and
second mold material encapsulating the first package and the second lead frame, wherein the second lead frame is a pre-molded lead frame, further comprising a third mold material encapsulating the second lead frame and forming a flat surface on which the first package is mounted.