CPC H01L 27/14669 (2013.01) [G01J 5/023 (2013.01); G01J 5/024 (2013.01); G01J 5/20 (2013.01); G01J 5/24 (2013.01); H01L 27/14636 (2013.01); H01L 27/14649 (2013.01); H01L 27/14683 (2013.01); H04N 5/33 (2013.01); H04N 25/75 (2023.01); G01J 2005/0077 (2013.01); G01J 2005/202 (2013.01)] | 20 Claims |
1. An infrared imaging device comprising:
a readout integrated circuit (ROIC) substrate comprising a plurality of contacts and a surface, wherein the surface defines a plane; and
a microbolometer array comprising a plurality of microbolometers, wherein each microbolometer comprises:
a microbolometer bridge comprising:
a first portion comprising:
a first dielectric layer;
a resistive layer disposed on the first dielectric layer and configured to capture infrared radiation; and
a second dielectric layer disposed on the resistive layer; and
a second portion having a plurality of perforations defined therein and being separate from and surrounding the first portion; and
a leg structure coupled to the microbolometer bridge and to one of the plurality of contacts and extending between the microbolometer bridge and the one of the plurality of contacts at least in a first direction substantially parallel to the plane, wherein the leg structure comprises a cross-section having a first section, a second section substantially parallel to the first section, and a third section joining the first section and the second section, wherein the first section and the second section extend along the first direction and a second direction substantially parallel to the plane, and wherein the cross-section is an s-shaped cross-section or a z-shaped cross-section maintained as the leg structure extends along a substantial length of the leg structure to form an s-shape or a z-shape when viewed in a direction along the length of the leg structure.
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