US 12,243,903 B2
Radiation detector, radiation CT apparatus, and method of manufacturing radiation detector
Takashi Ikeda, Kanagawa (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 4, 2023, as Appl. No. 18/295,354.
Claims priority of application No. 2023-034930 (JP), filed on Mar. 7, 2023.
Prior Publication US 2024/0304651 A1, Sep. 12, 2024
Int. Cl. H01L 27/146 (2006.01); G01N 23/046 (2018.01); G01N 23/083 (2018.01); G01T 1/24 (2006.01); H01L 23/544 (2006.01)
CPC H01L 27/14661 (2013.01) [G01N 23/046 (2013.01); G01N 23/083 (2013.01); G01T 1/247 (2013.01); H01L 23/544 (2013.01); H01L 27/14659 (2013.01); H01L 27/1469 (2013.01); H01L 2223/54426 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A radiation detector in which a semiconductor substrate configured to convert incident radiation into charges, a circuit board on which a readout circuit configured to read out signals generated by a plurality of pixels arranged on the semiconductor substrate is arranged, and a bonding layer arranged between the semiconductor substrate and the circuit board and configured to bond the semiconductor substrate and the circuit board are stacked on each other, wherein
each of the plurality of pixels comprises an electrode arranged on a first surface on a side of the circuit board out of two principal surfaces of the semiconductor substrate,
the readout circuit is arranged on a second surface on a side of the semiconductor substrate out of two principal surfaces of the circuit board, and is electrically connected, via a first conductive member penetrating the circuit board, to a conductive pattern arranged on a third surface on an opposite side of the second surface out of the two principal surfaces, and
the electrode is electrically connected to the readout circuit via the conductive pattern and a second conductive member arranged in a through hole penetrating the circuit board and the bonding layer.