| CPC H01L 27/1463 (2013.01) [H01L 27/14614 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01)] | 21 Claims |
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1. An image sensor comprising:
a substrate comprising:
a first surface;
a second surface opposite to the first surface; and
unit pixels;
a deep device isolation portion disposed in the substrate to isolate the unit pixels from each other;
transfer gates disposed on the first surface, wherein the transfer gates are respectively disposed in the unit pixels; and
color filters and a micro lens array layer that are sequentially stacked on the second surface,
wherein the deep device isolation portion comprises:
a first conductive pattern extending from the first surface toward the second surface; and
a second conductive pattern extending from the second surface toward the first conductive pattern, and
wherein the first conductive pattern directly contacts the second conductive pattern.
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