US 12,243,886 B2
Semiconductor package
Kyongsoon Cho, Incheon (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jan. 17, 2023, as Appl. No. 18/097,786.
Application 18/097,786 is a continuation of application No. 16/996,058, filed on Aug. 18, 2020, granted, now 11,574,943.
Claims priority of application No. 10-2019-0172320 (KR), filed on Dec. 20, 2019.
Prior Publication US 2023/0154954 A1, May 18, 2023
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14618 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14683 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor package, comprising:
providing a support substrate including a cavity that vertically penetrates the support substrate, wherein the support substrate comprises a first surface and a second surface that both extend from a first lateral surface of the support substrate to a second lateral surface of the support substrate;
providing an image sensor part, the image sensor part including a first semiconductor chip and a second semiconductor chip;
attaching the image sensor part to the first surface of the support substrate using a first adhesive layer on the first surface of the support substrate so as to cause an active array region of the second semiconductor chip to rest inside the cavity when viewed in plan, the support substrate being attached to an outer edge of the second semiconductor chip;
attaching a transparent substrate to the second surface of the support substrate which is opposite the first surface; and
cutting the support substrate and the first adhesive layer,
wherein the first adhesive layer extends along the first surface of the support substrate from the first lateral surface of the support substrate to the second lateral surface of the support substrate.