US 12,243,858 B2
Electronic component module, and method of manufacturing electronic component module
Toru Komatsu, Nagaokakyo (JP); and Tadashi Nomura, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Apr. 7, 2023, as Appl. No. 18/297,110.
Application 18/297,110 is a continuation of application No. PCT/JP2021/040195, filed on Nov. 1, 2021.
Claims priority of application No. 2020-187049 (JP), filed on Nov. 10, 2020.
Prior Publication US 2023/0246010 A1, Aug. 3, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/552 (2006.01)
CPC H01L 25/162 (2013.01) [H01L 23/552 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic component module comprising: a main substrate; a front side sub-module to be mounted on a front surface of the main substrate; an external connection terminal conductor provided on a back surface of the main substrate; and a back side sub-module to be mounted on the back surface of the main substrate, wherein: the front side sub-module includes: a first sub-substrate having: a first sub-main surface; and a second sub-main surface parallel to the first sub-main surface; a first sub-electronic component mounted on the first sub-main surface; and a second sub-electronic component mounted on the second sub-main surface; the main substrate has a through hole penetrating between the front surface and the back surface; the front side sub-module is mounted so that the second sub-electronic component is housed in the through hole; the back side sub-module includes: a second sub-substrate having: a third sub-main surface; and a fourth sub-main surface parallel to the third sub-main surface; and a third sub-electronic component mounted on the third sub-main surface; the second sub-electronic component is an electronic component having a heat-generating property; and the second sub-substrate has a heat transmission path, at a position overlapping with the second sub-electronic component, when viewed in a direction normal to the back surface of the main substrate, wherein, when viewed in the direction normal to the front surface and the back surface of the main substrate, the back side sub-module overlaps with the front side sub-module.