US 12,243,854 B2
Assembly substrate structure of semiconductor light emitting device and display device including the same
Myoungsoo Kim, Seoul (KR); Changseo Park, Seoul (KR); Gunho Kim, Seoul (KR); Minwoo Lee, Seoul (KR); and Jungsub Kim, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Filed by LG ELECTRONICS INC., Seoul (KR)
Filed on May 4, 2022, as Appl. No. 17/736,812.
Claims priority of application No. 10-2021-0116290 (KR), filed on Sep. 1, 2021.
Prior Publication US 2023/0060259 A1, Mar. 2, 2023
Int. Cl. H01L 25/075 (2006.01); H01L 33/38 (2010.01)
CPC H01L 25/0756 (2013.01) [H01L 33/38 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An overlapping assembly substrate structure for semiconductor light emitting devices, the overlapping assembly structure comprising:
a first assembly substrate structure and a second assembly substrate structure disposed spaced apart from each other,
wherein the first assembly substrate structure comprises a first electrode and a second electrode spaced apart by a first distance and a first partition wall having a circular first assembly hole to accommodate a semiconductor light emitting device having a circular shape, and
wherein the second assembly substrate structure comprises a third electrode and a fourth electrode spaced apart by a second distance greater than the first distance and a second partition wall having an elliptical second assembly hole to accommodate a semiconductor light emitting device having an elliptical shape.