US 12,243,853 B2
Stack package including core die stacked over a controller die
Bok Kyu Choi, Yongin-si (KR)
Assigned to SK hynix Inc., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on Oct. 2, 2023, as Appl. No. 18/479,280.
Application 18/479,280 is a division of application No. 17/072,959, filed on Oct. 16, 2020, granted, now 11,798,917.
Claims priority of application No. 10-2020-0060509 (KR), filed on May 20, 2020.
Prior Publication US 2024/0030191 A1, Jan. 25, 2024
Int. Cl. H01L 23/538 (2006.01); G11C 5/06 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01)
CPC H01L 25/0657 (2013.01) [G11C 5/06 (2013.01); H01L 23/5384 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A stack package comprising:
a first core die disposed over a package substrate;
a second core die disposed over the first core die;
a controller die disposed between the first core die and the package substrate, and controlling the first and second core dies; and
a bridge die spaced apart from the controller die,
wherein the first core die comprises:
first banks each including first memory cell arrays;
a first pad region in which first connection pads and first core die through vias are arranged; and
a first interbank region in which first row decoders and first column decoders electrically connected to the first connection pads through first wirings, second connection pads electrically connected to the first row decoders and first column decoders, and second core die through vias are arranged, and
wherein the controller die comprises:
a through via region in which controller die through vias penetrating the controller die to be connected to the first connection pads are disposed; and
a circuit region in which controlling circuitry electrically connected to the controller die through vias through second wirings are disposed, and
wherein the bridge die electrically connects the package substrate to the first row decoders and first column decoders through the second connection pads.