US 12,243,847 B2
Bonding apparatus and bonding method
Gil Yong Moon, Daejeon (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Jul. 24, 2021, as Appl. No. 17/384,750.
Claims priority of application No. 10-2020-0099711 (KR), filed on Aug. 10, 2020.
Prior Publication US 2022/0045029 A1, Feb. 10, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/67 (2006.01)
CPC H01L 24/741 (2013.01) [H01L 21/67248 (2013.01); H01L 24/95 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A bonding apparatus comprising:
a stage on which a substrate is seated, wherein the stage is configured to move in a first horizontal direction;
a gantry installed above the stage and extending in a second horizontal direction perpendicular to the first horizontal direction;
a bonding unit configured to bond a chip to the substrate while moving in the second horizontal direction along the gantry;
a first temperature sensor installed on the bonding unit and configured to provide a first temperature value corresponding to a temperature of the bonding unit;
a second temperature sensor installed at a periphery of the bonding apparatus and configured to provide a second temperature value corresponding to a temperature of air at the periphery of the bonding apparatus; and
a control device configured to:
cause the bonding unit to be aligned with a bonding position of the substrate,
control the bonding unit to allow the bonding unit to bond the chip at the bonding position of the substrate, and
determine a horizontal movement distance of the bonding unit in the second horizontal direction based on a weighted sum of the first temperature value and the second temperature value.