US 12,243,846 B2
Bonding wire, semiconductor package including the same, and wire bonding method
Keun-ho Choi, Anyang-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 20, 2021, as Appl. No. 17/380,276.
Application 17/380,276 is a division of application No. 16/361,339, filed on Mar. 22, 2019, granted, now 11,094,666.
Claims priority of application No. 10-2018-0116580 (KR), filed on Sep. 28, 2018.
Prior Publication US 2021/0351153 A1, Nov. 11, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/49 (2013.01) [H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 24/09 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/73215 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A wire bonding method for connecting a first pad and a second pad, the wire bonding method comprising:
forming a ball part by bonding a free air ball created at a first end of a wire to the first pad using a capillary;
forming a neck part on the ball part by vertically moving the capillary away from the first pad;
substantially leveling at least a portion of a top surface of the neck part by moving the capillary horizontally toward the second pad while a bottom surface of the capillary and the top surface of the neck part are at a common level;
forming a wire part by vertically moving the capillary toward the first pad, the wire part being connected to the neck part; and
extending and bonding the wire part to the second pad by moving the capillary to the second pad,
wherein a pressed region of the wire part has a V-shape and is in contact with the neck part, a side surface of the ball part and the first pad, and
wherein the substantially leveling of the at least the portion of the top surface of the neck part comprises substantially leveling all of the top surface of the neck part such that the wire part does not cover the top surface of the neck part and is in contact with a side surface of the neck part.