US 12,243,844 B2
Display device and method of manufacturing the same
Byoungyong Kim, Seoul (KR); Daehyuk Im, Hwaseong-si (KR); Seung-Soo Ryu, Hwaseong-si (KR); and Heeju Woo, Suwon-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Apr. 11, 2022, as Appl. No. 17/717,567.
Claims priority of application No. 10-2021-0075043 (KR), filed on Jun. 9, 2021.
Prior Publication US 2022/0399299 A1, Dec. 15, 2022
Int. Cl. H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01R 4/04 (2006.01); H01R 12/62 (2011.01); H05K 3/36 (2006.01); H01L 25/18 (2023.01)
CPC H01L 24/29 (2013.01) [H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01R 4/04 (2013.01); H01R 12/62 (2013.01); H05K 1/189 (2013.01); H05K 3/361 (2013.01); H01L 25/18 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/27001 (2013.01); H01L 2224/2712 (2013.01); H01L 2224/27418 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29418 (2013.01); H01L 2224/29424 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29457 (2013.01); H01L 2224/2946 (2013.01); H01L 2224/29471 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/0549 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/104 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A display device comprising:
a substrate including a display area and a pad area;
a plurality of pad electrodes disposed in the pad area on the substrate;
a circuit board disposed to overlap at least a portion of the pad area on the substrate, wherein the circuit board includes a base substrate and a plurality of bump electrodes disposed on a lower surface of the base substrate; and
an anisotropic conductive layer disposed in the pad area between the substrate and the circuit board, wherein the anisotropic conductive layer includes an adhesive layer and a plurality of conductive particles arranged in the adhesive layer,
wherein each of the conductive particles includes a core, a first conductive film disposed on the core in a way such that at least a portion of the core is exposed, and a second conductive film entirely covering the core and the first conductive film, and
wherein the first conductive film is a single conductive film continuously extending in a way such that a half portion or at least a half portion of the core is exposed.