US 12,243,838 B2
Circuit substrate structure and manufacturing method thereof
Tzyy-Jang Tseng, Taoyuan (TW); Pu-Ju Lin, Hsinchu (TW); Cheng-Ta Ko, Taipei (TW); and John Hon-Shing Lau, Taoyuan (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Jan. 4, 2022, as Appl. No. 17/567,883.
Application 17/567,883 is a continuation in part of application No. 17/098,436, filed on Nov. 15, 2020, granted, now 11,410,971.
Claims priority of application No. 109128362 (TW), filed on Aug. 20, 2020; and application No. 110141784 (TW), filed on Nov. 10, 2021.
Prior Publication US 2022/0130781 A1, Apr. 28, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/06 (2013.01) [H01L 21/4853 (2013.01); H01L 23/5381 (2013.01); H01L 25/50 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A circuit substrate structure, comprising:
a circuit substrate, having a first surface and a second surface opposite to each other;
at least two chips, arranged in parallel on the first surface of the circuit substrate and electrically connected to the circuit substrate, wherein the at least two chips have active surfaces, back surfaces opposite to the active surfaces, and side surfaces connecting the active surfaces and the back surfaces, and the at least two chips comprise:
side circuits, arranged on the side surfaces of the at least two chips and having first ends and second ends, wherein the first ends extend to the active surfaces along the side surfaces, and the second ends extend to the back surfaces along the side surfaces; and
a bridge element, arranged on the back surfaces of the at least two chips and electrically connected to the active surfaces of the at least two chips through the side circuits.