| CPC H01L 23/5286 (2013.01) [H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); G06F 30/394 (2020.01)] | 20 Claims |
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1. A conductive line structure in an integrated circuit (IC), the conductive line structure comprising:
first and second sets of long pillars that extend in a first direction, members of the first and second sets being substantially coaxial correspondingly on an intra-set basis; and
the second set being offset from the first set relative to a second direction perpendicular to the first direction;
a third set of short pillars, the short pillars extending in the second direction and being:
offset from each other relative to the first direction;
overlapping of corresponding long pillars in the first and second sets; and
organized into groups, each group having a first quantity of the short pillars in the third set;
each of the groups of the third set being overlapping of and electrically coupled between a corresponding pair of one of the long pillars in the first set and a corresponding one of the long pillars in the second set such that, in each of the groups, each short pillar being overlapping of and electrically coupled between the corresponding pair; and
each long pillar in each of the first and second sets being overlapped by a second quantity of corresponding short pillars in the third set and being electrically coupled to same; and
the first quantity being less than the second quantity.
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