US 12,243,819 B2
Single-mask alternating line deposition
Brent Alan Anderson, Jericho, VT (US); Lawrence A. Clevenger, Saratoga Springs, NY (US); Christopher J. Penny, Saratoga Springs, NY (US); Kisik Choi, Watervliet, NY (US); Nicholas Anthony Lanzillo, Wynantskill, NY (US); and Robert Robison, Rexford, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Jul. 26, 2022, as Appl. No. 17/873,888.
Application 17/873,888 is a division of application No. 16/786,393, filed on Feb. 10, 2020, granted, now 11,437,317.
Prior Publication US 2022/0359394 A1, Nov. 10, 2022
Int. Cl. H01L 23/528 (2006.01); H01L 21/768 (2006.01)
CPC H01L 23/5283 (2013.01) [H01L 21/76804 (2013.01); H01L 21/76829 (2013.01); H01L 21/76834 (2013.01); H01L 21/7684 (2013.01); H01L 21/76877 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An integrated chip, comprising:
a plurality of first lines, formed on an underlying substrate, having sidewalls with a consistent slope;
spacers formed conformally on sidewalls of the plurality of first lines;
etch stop remnants positioned on the sidewalls of the plurality of first lines, between the spacers and the underlying substrate; and
a plurality of second lines, formed on the underlying substrate, between respective pairs of adjacent first lines, having sidewalls with a profile that includes a step.