US 12,243,813 B2
Connection structure and method of forming the same
Jongyoun Kim, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 10, 2023, as Appl. No. 18/483,884.
Application 18/483,884 is a continuation of application No. 17/857,696, filed on Jul. 5, 2022, granted, now 11,810,849.
Application 17/857,696 is a continuation of application No. 17/085,436, filed on Oct. 30, 2020, granted, now 11,437,310, issued on Sep. 6, 2022.
Application 17/085,436 is a continuation of application No. 16/447,441, filed on Jun. 20, 2019, granted, now 10,833,002, issued on Nov. 10, 2020.
Claims priority of application No. 10-2018-0155947 (KR), filed on Dec. 6, 2018.
Prior Publication US 2024/0055344 A1, Feb. 15, 2024
Int. Cl. H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H05K 1/03 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/182 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48229 (2013.01); H05K 1/0284 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 1/115 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 2201/10378 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A connection structure comprising:
a first passivation layer;
a first conductive pattern that penetrates the first passivation layer and partially protrudes upwardly from the first passivation layer;
a second passivation layer on the first passivation layer and covering the first conductive pattern;
a second conductive pattern on the second passivation layer, the second conductive pattern comprises a second head segment that horizontally extends on an uppermost surface of the second passivation layer and a second tail segment that vertically penetrates the second passivation layer and connected to the first conductive pattern;
a third passivation layer on the second passivation layer and covering the second conductive pattern; and
a third conductive pattern on the third passivation layer, the third conductive pattern comprises a third head segment that horizontally extends on an uppermost surface of the third passivation layer and a third tail segment that vertically penetrates the third passivation layer;
wherein a thickness of the third head segment is greater than a thickness of the second head segment, and smaller than a thickness of the first conductive pattern, and
wherein the second passivation layer is the thickest among the first passivation layer, the second passivation layer, and the third passivation layer.