US 12,243,809 B2
Packaged electronic device with film isolated power stack
Tianyi Luo, Allen, TX (US); Jonathan Almeria Noquil, Plano, TX (US); and Osvaldo Jorge Lopez, Annandale, NJ (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Apr. 25, 2023, as Appl. No. 18/306,808.
Application 17/318,974 is a division of application No. 16/445,836, filed on Jun. 19, 2019, granted, now 11,024,564, issued on Jun. 1, 2021.
Application 18/306,808 is a continuation of application No. 17/318,974, filed on May 12, 2021, granted, now 11,640,932.
Prior Publication US 2023/0268253 A1, Aug. 24, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/49513 (2013.01) [H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49537 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/49586 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/074 (2013.01); H01L 25/50 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/13091 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A packaged electronic device, comprising:
a first recess in a first side of a first conductive plate;
a first conductive epoxy on a first bottom of the first recess;
a first side of a first semiconductor die attached to the first conductive epoxy to electrically couple the first side of the first semiconductor die to the first bottom of the first recess of the first conductive plate;
a first intermediate conductive epoxy on a second side of the first semiconductor die;
a second recess in a first side of a second conductive plate;
a second conductive epoxy on a second bottom of the second recess;
a first side of a second semiconductor die attached to the second conductive epoxy to electrically couple the first side of the second semiconductor die to the second bottom of the second recess of the second conductive plate;
a second side of the second conductive plate attached to the first intermediate conductive epoxy to electrically couple the second side of the second conductive plate to the second side of the first semiconductor die;
a second intermediate conductive epoxy on a second side of the second semiconductor die;
a first side of a third conductive plate attached to the second intermediate conductive epoxy to electrically couple the first side of the third conductive plate to the second side of the second semiconductor die; and
a package structure that encloses the first semiconductor die, and the second semiconductor die, the package structure including a side that exposes a portion of the second side of the first conductive plate.