US 12,243,807 B2
Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods
Hong Wan Ng, Singapore (SG); Chin Hui Chong, Singapore (SG); Hem P. Takiar, Fremont, CA (US); Seng Kim Ye, Singapore (SG); and Kelvin Tan Aik Boo, Singapore (SG)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Dec. 27, 2023, as Appl. No. 18/398,120.
Application 18/398,120 is a division of application No. 17/982,397, filed on Nov. 7, 2022, granted, now 11,894,289.
Application 17/982,397 is a division of application No. 17/243,466, filed on Apr. 28, 2021, granted, now 11,527,459, issued on Dec. 13, 2022.
Prior Publication US 2024/0128163 A1, Apr. 18, 2024
Int. Cl. H01L 29/76 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 27/08 (2006.01); H01L 29/00 (2006.01); H01L 49/02 (2006.01)
CPC H01L 23/481 (2013.01) [H01L 23/49816 (2013.01); H01L 27/0805 (2013.01); H01L 28/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor die;
a first capacitor having electrical contacts separated by a first spacing; and
a substrate electrically coupling the semiconductor die and the first capacitor,
wherein:
the substrate includes:
a first pair of electrical contacts on a first surface of the substrate and configured to receive the first capacitor to connect a first circuit branch to a second circuit branch, the electrical contacts of the first pair separated by a first distance corresponding to the first spacing; and
a second pair of electrical contacts on the first surface of the substrate and configured to receive a second capacitor to connect a third circuit branch to a fourth circuit branch, the electrical contacts of the second pair separated by a second distance corresponding to a second spacing between electrical contacts of the second capacitor, and
the electrical contacts of the first pair and the electrical contacts of the second pair are arranged such that, when the first capacitor is electrically coupled to the electrical contacts of the first pair, the first capacitor occupies a space between the electrical contacts of the second pair and prevents the electrical contacts of the second pair from receiving the second capacitor.