US 12,243,804 B1
Cooling heatshield for clamshell BGA rework
Sue Yun Teng, Belmont, CA (US)
Assigned to Google LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Aug. 29, 2023, as Appl. No. 18/239,361.
Application 18/239,361 is a continuation of application No. 17/202,552, filed on Mar. 16, 2021, granted, now 11,791,239.
Int. Cl. H01L 23/467 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/467 (2013.01) [H01L 23/49816 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a backer plate including at least one air inlet port;
a metal plate coupled to the backer plate; and
a package pedestal coupled to the backer plate,
wherein the metal plate and the backer plate form one or more outlets extending along a surface of the package pedestal,
wherein the one or more outlets include a recess in the package pedestal, the recess extending outward to a perimeter edge of the package pedestal,
wherein the at least one air inlet port is configured to receive gas, and
wherein the gas is configured to exit the system through at least one of the one or more outlets.