US 12,243,802 B2
Methods and heat distribution devices for thermal management of chip assemblies
Madhusudan K. Iyengar, Foster City, CA (US); Christopher Malone, Mountain View, CA (US); Woon-Seong Kwon, Santa Clara, CA (US); Emad Samadiani, Cupertino, CA (US); Melanie Beauchemin, Mountain View, CA (US); Padam Jain, San Jose, CA (US); Teckgyu Kang, Saratoga, CA (US); Yuan Li, Sunnyvale, CA (US); Connor Burgess, Alameda, CA (US); Norman Paul Jouppi, Palo Alto, CA (US); Nicholas Stevens-Yu, Palo Alto, CA (US); and Yingying Wang, Sunnyvale, CA (US)
Assigned to Google LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Apr. 12, 2024, as Appl. No. 18/634,198.
Application 18/634,198 is a division of application No. 17/333,570, filed on May 28, 2021, granted, now 11,990,386.
Claims priority of provisional application 63/066,550, filed on Aug. 17, 2020.
Claims priority of provisional application 63/032,197, filed on May 29, 2020.
Prior Publication US 2024/0347414 A1, Oct. 17, 2024
Int. Cl. H01L 23/00 (2006.01); B23K 1/00 (2006.01); H01L 23/373 (2006.01); H05K 3/34 (2006.01); H05K 7/20 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3732 (2013.01) [H01L 23/562 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 3/3436 (2013.01); H05K 7/20254 (2013.01); H01L 25/0655 (2013.01); H01L 2223/58 (2013.01); H01L 2224/32 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/041 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method of assembling a cooling loop assembly to an in-process unit comprising:
joining a plurality of in-process units to a circuit board, each in-process unit including:
a substrate; and
at least one microelectronic element electrically connected to the substrate, the microelectronic element having an active front surface facing toward the substrate and an opposed rear surface facing away from the substrate;
joining a corresponding plurality of heat distribution devices to the plurality of in-process units, each of the corresponding plurality of heat distribution devices including an inlet and an outlet; and
bonding a cooling loop assembly to the inlet and outlet of each of the plurality of heat distribution devices, the cooling loop assembly including a network of fluid lines connected to each inlet and each outlet.