US 12,243,799 B2
Electronic packages with integral heat spreaders
Charles Bailley, San Jose, CA (US); George Chu, Irvine, CA (US); and Daniel M. Kinzer, El Segundo, CA (US)
Assigned to NAVITAS SEMICONDUCTOR LIMITED, Dublin (IE)
Filed by Navitas Semiconductor Limited, Dublin (IE)
Filed on May 6, 2022, as Appl. No. 17/738,989.
Application 17/738,989 is a continuation of application No. 17/702,694, filed on Mar. 23, 2022.
Claims priority of provisional application 63/165,529, filed on Mar. 24, 2021.
Prior Publication US 2022/0310476 A1, Sep. 29, 2022
Int. Cl. H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4882 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 23/49861 (2013.01); H01L 23/5389 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a substrate;
an electronic package attached to the substrate and comprising:
a leadframe;
a gallium nitride (GaN) based semiconductor die attached to the leadframe; and
a first molding material encapsulating at least a portion of the leadframe and at least a portion of the GaN-based semiconductor die;
an integral heat spreader thermally coupled to the leadframe; and
a second molding material encapsulating at least a portion of the substrate, at least a portion of the electronic package and at least a portion of the integral heat spreader.