| CPC H01L 23/3675 (2013.01) [H01L 21/4882 (2013.01); H01L 23/3164 (2013.01); H01L 23/36 (2013.01)] | 20 Claims |
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1. A semiconductor package, comprising:
a circuit substrate;
a semiconductor chip mounted on the circuit substrate; and
a thermal radiation film covering the semiconductor chip on the circuit substrate,
wherein the semiconductor chip includes:
first lateral surfaces that are opposite to each other in a first direction; and
second lateral surfaces that are opposite to each other in a second direction that intersects the first direction,
wherein a first width of the first lateral surfaces is less than a second width of the second lateral surfaces,
wherein the thermal radiation film covers a top surface of the semiconductor chip and covers the first lateral surfaces and the second lateral surfaces of the semiconductor chip, and
wherein the thermal radiation film has a plurality of slits that are directed toward the first lateral surfaces from ends of the thermal radiation film.
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