US 12,243,790 B2
Semiconductor device and inverter device
Yosuke Miyagi, Fukuoka (JP); Hideki Tsukamoto, Fukuoka (JP); Takuro Mori, Fukuoka (JP); Masaru Furukawa, Fukuoka (JP); Korehide Okamoto, Fukuoka (JP); Takamasa Oda, Fukuoka (JP); Seiji Saiki, Fukuoka (JP); and Takeshi Ogawa, Fukuoka (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Apr. 12, 2022, as Appl. No. 17/658,995.
Claims priority of application No. 2021-113017 (JP), filed on Jul. 7, 2021.
Prior Publication US 2023/0010169 A1, Jan. 12, 2023
Int. Cl. H01L 23/34 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/10 (2013.01) [H01L 23/3672 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a heat sink;
a wiring board contacting an upper surface of the heat sink;
a semiconductor chip contacting an upper surface of the wiring board;
a case housing provided on the heat sink so as to surround the wiring board and the semiconductor chip;
an adhesive that adheres a lower surface joint portion of the case housing and
an upper surface joint portion of the heat sink located at positions where the case housing and the heat sink are facing each other;
a sealing material that fills the case housing and covers the wiring board and the semiconductor chip;
a first convex portion provided on the lower surface joint portion of the case housing or the upper surface joint portion of the heat sink that separates the adhesive from the sealing material;
a second convex portion provided on the upper surface joint portion of the heat sink or the lower surface joint portion of the case housing and provided more outside than the first convex portion is;
a first concave portion provided on the upper surface joint portion of the heat sink or the lower surface joint portion of the case housing and fitted with the first convex portion; and
a second concave portion provided on the upper surface joint portion of the heat sink or the lower surface joint portion of the case housing and fitted with the second convex portion, wherein
the adhesive is applied in a region surrounded by the first convex portion and the second convex portion,
a depth of the first concave portion is shallow with respect to a height of the first convex portion, and
a depth of the second concave portion is shallow with respect to a height of the second convex portion.