US 12,243,766 B2
Back grinding adhesive sheet, and method for manufacturing semiconductor wafer
Karl Heinz Priewasser, Kirchheim b. Muenchen (JP); Tomoya Tsukui, Tokyo (JP); Tomoyuki Kanai, Tokyo (JP); and Takeshi Saito, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP); and DENKA COMPANY LIMITED, Tokyo (JP)
Appl. No. 17/434,257
Filed by DISCO CORPORATION, Tokyo (JP); and DENKA COMPANY LIMITED, Tokyo (JP)
PCT Filed Feb. 21, 2020, PCT No. PCT/JP2020/007032
§ 371(c)(1), (2) Date Aug. 26, 2021,
PCT Pub. No. WO2020/175364, PCT Pub. Date Sep. 3, 2020.
Claims priority of application No. 2019-032961 (JP), filed on Feb. 26, 2019.
Prior Publication US 2022/0148905 A1, May 12, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 41/06 (2012.01); B24B 7/22 (2006.01); C09J 7/29 (2018.01); C09J 7/38 (2018.01); H01L 21/02 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6836 (2013.01) [B24B 7/228 (2013.01); B24B 41/06 (2013.01); C09J 7/29 (2018.01); C09J 7/387 (2018.01); H01L 21/02013 (2013.01); H01L 21/02016 (2013.01); C09J 2203/326 (2013.01); C09J 2301/204 (2020.08); C09J 2301/414 (2020.08); C09J 2301/502 (2020.08); C09J 2423/046 (2013.01); C09J 2425/006 (2013.01); C09J 2453/00 (2013.01); H01L 2221/68386 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An adhesive sheet for back grinding of a semiconductor wafer having convex portions, comprising a non-adhesive cushion layer and an adhesive layer provided on the cushion layer,
wherein the adhesive layer comprises an opening with a diameter smaller than a diameter of the semiconductor wafer,
the adhesive layer is configured to be attached to an outer periphery of the semiconductor wafer so that the convex portions of the semiconductor wafer are placed in the opening, whereby the convex portions are protected by the cushion layer in a state where the semiconductor wafer is attached to the adhesive layer, and
at least one of the following conditions (1) and (2) is satisfied:
(1) tensile stress of the cushion layer punched out by using a dumbbell according to JISZ1702 is 2 to 30N/10 mm when the punched-out cushion layer is stretched by 25% at a distance between gauge lines of 40 mm and a tensile speed of 300 mm/min; and
(2) the cushion layer is composed of a thermoplastic resin with a melt flow rate of 0.2 to 30 g/10 min under 125° C./10.0 kg load according to JISK7210 and a melting point of 60 to 110° C.