US 12,243,763 B2
Substrate fixing device and electrostatic chuck
Masakuni Miyazawa, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Sep. 2, 2020, as Appl. No. 17/010,149.
Claims priority of application No. 2019-169649 (JP), filed on Sep. 18, 2019.
Prior Publication US 2021/0082731 A1, Mar. 18, 2021
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67109 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate fixing device comprising:
a baseplate including a gas supply part;
an electrostatic chuck on the baseplate, the electrostatic chuck including a substrate and configured to attract an object onto a first surface of the substrate, the substrate having a gas hole extending from a second surface of the substrate to the first surface, the second surface facing the baseplate, so that gas is supplied from the gas supply part to the first surface; and
a porous body in the gas hole,
wherein the gas hole includes
a first recess formed in the second surface and depressed toward the first surface;
a second recess formed at a bottom of the first recess and depressed toward the first surface; and
a through hole piercing through the substrate from a bottom of the second recess to the first surface,
an entirety of the first recess is filled with the porous body, the second recess is partly filled with the porous body, and a region of the second recess unfilled with the porous body is a recess in the porous body and a space communicating with the through hole, the recess being depressed toward the second surface relative to a position where the bottom of the second recess communicates with the through hole, and
the gas supply part communicates with the gas hole to discharge the gas directly to the gas hole.