US 12,243,759 B2
Substrate for manufacturing display device and method for manufacturing display device
Kisu Kim, Seoul (KR); Changseo Park, Seoul (KR); and Philwon Yoon, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 17/620,432
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Jun. 24, 2019, PCT No. PCT/KR2019/007590
§ 371(c)(1), (2) Date Dec. 17, 2021,
PCT Pub. No. WO2020/256203, PCT Pub. Date Dec. 24, 2020.
Claims priority of application No. 10-2019-0072398 (KR), filed on Jun. 18, 2019.
Prior Publication US 2022/0351992 A1, Nov. 3, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01)
CPC H01L 21/67144 (2013.01) [H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 33/325 (2013.01); H01L 33/40 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/95001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An assembly substrate used in a display manufacturing method for placing semiconductor light-emitting devices to predetermined positions thereof using an electric field and a magnetic field, the assembly substrate comprising:
a base part;
a plurality of pair electrodes extending in one direction and disposed in parallel on the base part;
a dielectric layer disposed on the base part to cover the plurality of pair electrodes; and
partition walls disposed on the dielectric layer and defining cells at predetermined intervals along the one direction of the plurality of pair electrodes so as to overlap portions of the plurality of pair electrodes, and the semiconductor light-emitting devices being placed into the cells, respectively,
wherein at least one of a recess portion and a concave and convex portion formed on an upper surface of each of the partition walls reduces energy acting between the assembly substrate and a transfer substrate.
 
18. An assembly substrate to seat semiconductor light emitting diodes at preset positions on the assembly substrate, the assembly substrate comprising:
a plurality of pair electrodes extending in one direction at predetermined intervals;
a dielectric layer to cover the plurality of pair electrodes;
partition walls on the dielectric layer and defining cells at the preset positions; and
at least one of a recess portion and a concave and convex portion formed on an upper surface of each of the partition walls reduces energy acting between the assembly substrate and a transfer substrate.