US 12,243,756 B2
Temperature controlled substrate support assembly
Vijay D. Parkhe, San Jose, CA (US); Konstantin Makhratchev, Fremont, CA (US); Masanori Ono, Chiba (JP); and Zhiqiang Guo, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Sep. 23, 2021, as Appl. No. 17/483,509.
Application 17/483,509 is a continuation of application No. 14/285,606, filed on May 22, 2014, granted, now 11,158,526.
Claims priority of provisional application 61/937,348, filed on Feb. 7, 2014.
Prior Publication US 2022/0013374 A1, Jan. 13, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67103 (2013.01) [H01L 21/67248 (2013.01); H01L 21/6831 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electrostatic chuck (ESC), comprising:
a dielectric body formed from ceramic material, the dielectric body comprising:
an upper surface and a lower surface,
a chucking electrode disposed in the dielectric body,
main resistive heaters arranged in a plurality of zones and disposed in the dielectric body, and
a plurality of secondary heaters in the dielectric body between the main resistive heaters and one of the upper surface and the lower surface, wherein a quantity of the secondary heaters is greater than a quantity of the main resistive heaters, each secondary heater and each zone of main resistive heaters coupled to a unique power circuit within the dielectric body, each power circuit configured to independently operate the connected secondary heater and each zone of main resistive heaters between an on state and an off state without changing the on state and off state of any of the other secondary heaters as well as the each zone of the main resistive heaters.