US 12,243,755 B2
Carrier film disposed on a mother substrate and method of manufacturing a semiconductor package
Taesung Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 23, 2023, as Appl. No. 18/237,115.
Application 18/237,115 is a continuation of application No. 17/232,328, filed on Apr. 16, 2021, granted, now 11,764,079.
Claims priority of application No. 10-2020-0157492 (KR), filed on Nov. 23, 2020.
Prior Publication US 2023/0395397 A1, Dec. 7, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01)
CPC H01L 21/561 (2013.01) [H01L 21/568 (2013.01); H01L 23/31 (2013.01); H01L 23/3128 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A carrier film disposed on a mother substrate that includes a multi-layer circuit, the carrier film comprising:
a base material layer; and
an adhesive layer configured to attach the base material layer onto the mother substrate,
wherein:
the carrier film includes a plurality of openings passing therethrough from a top surface to a bottom surface thereof,
the mother substrate includes a first surface on which the carrier film is attachable, a second surface including a plurality of semiconductor chips attached thereon, and a plurality of open areas on the first surface of the mother substrate and exposed by the plurality of openings of the carrier film,
each of the plurality of open areas includes a solder ball area respectively including a plurality of solder balls thereon, and
the plurality of openings of the carrier film overlap the solder ball area of the mother substrate,
wherein the adhesive layer includes a water soluble material.