| CPC H01L 21/268 (2013.01) [C30B 25/20 (2013.01); C30B 29/406 (2013.01); C30B 33/04 (2013.01); H01L 21/02389 (2013.01); H01L 21/0254 (2013.01); H01L 21/3043 (2013.01); H01L 21/30625 (2013.01); H01L 29/66462 (2013.01)] | 20 Claims |

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1. A method for stripping a gallium nitride substrate, comprising:
acquiring a gallium nitride substrate with a gallium nitride epitaxial structure directly grown on an upper surface thereof;
scanning and irradiating an interior of the gallium nitride substrate via the gallium nitride epitaxial structure by a laser beam, so as to generate a decomposition layer in the gallium nitride substrate, the laser beam being a laser having a pulse width on the order of less than 10−15s, and a distance between the decomposition layer and the upper surface of the gallium nitride substrate being less than a thickness of the gallium nitride substrate; and
separating the gallium nitride substrate at the decomposition layer, so as to obtain a stripped gallium nitride substrate and a semiconductor device,
wherein before scanning and irradiating the interior of the gallium nitride substrate via the gallium nitride epitaxial structure by the laser beam, the method further comprises:
grooving the gallium nitride epitaxial structure and the gallium nitride substrate by a laser grooving technique to form grooves, depths of the grooves being equal to the distance between the decomposition layer and the upper surface of the gallium nitride epitaxial structure.
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