US 12,243,727 B2
Substrate processing apparatus including electrostatic chuck, substrate processing method, and method of manufacturing electrostatic chuck
Dong Chan Lee, Anseong-si (KR); and Kyo Bong Kim, Suwon-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Aug. 16, 2022, as Appl. No. 17/889,298.
Claims priority of application No. 10-2021-0111958 (KR), filed on Aug. 24, 2021.
Prior Publication US 2023/0064141 A1, Mar. 2, 2023
Int. Cl. H01J 37/32 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01J 37/32715 (2013.01) [H01L 21/6833 (2013.01); H01L 21/68742 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/334 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electrostatic chuck, comprising:
a chuck body which supports a substrate;
at least one pin hole penetrating the chuck body in a vertical direction;
a lift pin disposed in one of the at least one pin hole, wherein the lift pin moves along the one of the at least one pin hole; and
an expansion member which is provided at an inner circumference of the one of the at least one pin hole, the expansion member having an inner circumferential surface that, in response to a first power supplied to the expansion member, selectively holds or releases an outer circumferential surface of the lift pin.