US 12,243,726 B2
Substrate supporting unit, apparatus for treating substrate including the same, and ring transfer method
Jae-Won Shin, Seoul (KR)
Assigned to Semes Co., Ltd., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Dec. 14, 2022, as Appl. No. 18/066,003.
Claims priority of application No. 10-2022-0149011 (KR), filed on Nov. 9, 2022.
Prior Publication US 2024/0153747 A1, May 9, 2024
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32642 (2013.01) [H01J 37/32715 (2013.01); H01J 2237/3343 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a process chamber having a treating space therein;
a substrate support unit configured to support a substrate in the treating space;
a gas supply unit configured to supply a process gas to the treating space; and
a plasma source for generating a plasma from the process gas, and
wherein the substrate support unit comprises:
a support plate on which the substrate is placed;
a base which is positioned below the support plate;
a first ring provided to surround the substrate placed on the support unit;
a second ring provided below the first ring and having a through hole; and
a ring lift pin assembly for lifting and lowering the first ring and the second ring, and
wherein the ring lift pin assembly comprises:
a first pin provided to be inserted into the through hole and to lift and lower the first ring;
a second pin in a hollow shaft shape to lift and lower the second ring and having a hole at which first pin passes through within; and
a driving unit for driving the first pin and the second pin, and
wherein the through hole overlaps the first ring when seen from above.
 
11. A substrate support unit provided within a process chamber and having a substrate placed thereon comprising:
a support plate on which the substrate placed;
a first ring provided to surround the substrate placed on the support plate;
a second ring provided below the first ring and having a through hole; and
a ring lift pin assembly for lifting and lowering the first ring and the second ring, and
wherein the ring lift pin assembly comprises:
a first pin provided to be inserted into the through hole and for lifting and lowering the first ring;
a second pin in a hollow shape for lifting and lowering the second ring and having a hole for letting the first pin passes through within; and
a driving unit for driving the first pin and the second pin, and
wherein the through hole overlaps the first ring when seen from above.