US 12,243,718 B2
Plasma processing method and plasma processing apparatus
Eiki Kamata, Yamanashi (JP); Mikio Sato, Yamanashi (JP); Taro Ikeda, Yamanashi (JP); and Nobuhiko Yamamoto, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/599,912
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
PCT Filed Mar. 23, 2020, PCT No. PCT/JP2020/012686
§ 371(c)(1), (2) Date Sep. 29, 2021,
PCT Pub. No. WO2020/203406, PCT Pub. Date Oct. 8, 2020.
Claims priority of application No. 2019-071541 (JP), filed on Apr. 3, 2019.
Prior Publication US 2022/0199369 A1, Jun. 23, 2022
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/3222 (2013.01) [H01J 37/32238 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A plasma processing method in a plasma processing apparatus including a chamber, a stage on which a substrate is placed in the chamber, a plurality of radiating devices configured to radiate a plurality of electromagnetic waves, and a dielectric window disposed between the plurality of radiating devices and the stage, the method comprising:
preparing the substrate on the stage;
controlling a phase of at least one of the plurality of electromagnetic waves from the plurality of radiating devices;
propagating the plurality of electromagnetic waves from the plurality of radiating devices into a space above the dielectric window for focusing electromagnetic waves, concentrating the electromagnetic waves from the plurality of radiating devices at a predetermined position on the dielectric window, and radiating the concentrated electromagnetic waves into a space below the dielectric window, wherein the dielectric window is a partition plate that divides an inside of the chamber into the space above the dielectric window and the space below the dielectric window; and
processing the substrate using localized plasma generated from a gas supplied between the dielectric window and the stage.
 
9. A plasma processing apparatus comprising:
a chamber;
a stage on which a substrate is placed in the chamber;
a plurality of radiating devices configured to radiate a plurality of electromagnetic waves;
a dielectric window disposed between the plurality of the radiating devices and the stage, wherein the dielectric window is a partition plate that divides an inside of the chamber into a space above the dielectric window for focusing electromagnetic waves and a space below the dielectric window; and
a controller,
wherein the controller is configured to control:
preparing the substrate on the stage;
controlling a phase of at least one of the plurality of electromagnetic waves from the plurality of radiating devices;
propagating the plurality of electromagnetic waves from the plurality of radiating devices into the space above the dielectric window, concentrating the electromagnetic waves from the plurality of radiating devices at a predetermined position on the dielectric window, and radiating the concentrated electromagnetic waves into the space below the dielectric window; and
processing the substrate using localized plasma generated from a gas supplied between the dielectric window and the stage.