US 12,243,682 B2
Demountable solder joints for coupling superconducting current paths
Brian Labombard, Belmont, MA (US); William Beck, Watertown, MA (US); and Theodore Mouratidis, Melbourne (AU)
Assigned to Massachusetts Institute of Technology, Cambridge, MA (US)
Appl. No. 17/913,459
Filed by Massachusetts Institute of Technology, Cambridge, MA (US)
PCT Filed Mar. 25, 2021, PCT No. PCT/US2021/024151
§ 371(c)(1), (2) Date Sep. 22, 2022,
PCT Pub. No. WO2021/257145, PCT Pub. Date Dec. 23, 2021.
Claims priority of provisional application 63/000,413, filed on Mar. 26, 2020.
Prior Publication US 2023/0207171 A1, Jun. 29, 2023
Int. Cl. H01F 6/06 (2006.01); G21B 1/05 (2006.01)
CPC H01F 6/065 (2013.01) [G21B 1/057 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first plate comprising a plurality of channels that include a first layer of a high temperature superconductor (HTS) and a first electrically conductive layer over the first layer of the HTS, wherein the first plate comprises at least one solder flow pathway extending from an exterior of the first plate to at least one of the plurality of channels of the first plate;
a second plate comprising a plurality of channels that include a second layer of the HTS and a second electrically conductive layer over the second layer of the HTS; and
a layer of solder contacting a portion of the first electrically conductive layer of the first plate and a portion of the second electrically conductive layer of the second plate,
wherein the second plate is disposed over the first plate such that the portion of the first electrically conductive layer is arranged next to the portion of the second electrically conductive layer with the layer of solder between the portion of the first electrically conductive layer and the portion of the second electrically conductive layer, thereby providing an electrically conductive path from the first electrically conductive layer to the second electrically conductive layer.