US 12,243,667 B2
Manufacturing method of resistor and resistor
Yohei Tokiwa, Nagano (JP); Kohji Eto, Nagano (JP); Tomofumi Noguchi, Nagano (JP); and Reina Kaneko, Nagano (JP)
Assigned to KOA Corporation, Nagano (JP)
Appl. No. 17/759,487
Filed by KOA Corporation, Nagano (JP)
PCT Filed Dec. 25, 2020, PCT No. PCT/JP2020/048953
§ 371(c)(1), (2) Date Jul. 26, 2022,
PCT Pub. No. WO2021/153138, PCT Pub. Date Aug. 5, 2021.
Claims priority of application No. 2020-011192 (JP), filed on Jan. 27, 2020.
Prior Publication US 2023/0146171 A1, May 11, 2023
Int. Cl. H01C 1/14 (2006.01); H01C 17/00 (2006.01)
CPC H01C 1/14 (2013.01) [H01C 17/006 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A manufacturing method of a resistor comprising:
a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in a stacked direction;
a step of passing the resistor base material through a die by using a drawing method, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and
a step of obtaining an individual resistor from the resistor base material passed through the die, wherein
the opening portion has a rectangular shape,
a part of one side of the rectangular shape of the opening portion has protuding shape towards a center of opening,
the protruding shape makes a groove in the resistor base material, and
the resistor base material is out from a one surface side of the resistor base material in which the groove is formed towards an opposite face side of the one surface.