US 12,243,620 B2
Electronic devices comprising air gaps adjacent to bitlines
Mithun Kumar Ramasahayam, Merdian, ID (US); and Michael J. Gossman, Meridian, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Nov. 8, 2022, as Appl. No. 18/053,626.
Application 18/053,626 is a continuation of application No. 17/097,494, filed on Nov. 13, 2020, granted, now 11,508,421.
Prior Publication US 2023/0081678 A1, Mar. 16, 2023
Int. Cl. G11C 7/18 (2006.01); H01L 29/06 (2006.01); H10B 41/20 (2023.01); H10B 41/35 (2023.01)
CPC G11C 7/18 (2013.01) [H01L 29/0649 (2013.01); H10B 41/20 (2023.02); H10B 41/35 (2023.02)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
bitlines and air gaps adjacent to an array region of an electronic device, the bitlines comprising sloped sidewalls and the air gaps extending a distance above the bitlines and a distance below the bitlines, the bitlines directly adjacent to the air gaps.