US 12,243,218 B2
Method and system for scanning wafer
Pei-Hsuan Lee, Taipei (TW); Chien-Hsiang Huang, Hsinchu (TW); Kuang-Shing Chen, Hsinchu (TW); Kuan-Hsin Chen, Hsinchu (TW); and Chun-Chieh Chin, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Jul. 27, 2023, as Appl. No. 18/359,871.
Application 18/359,871 is a continuation of application No. 17/346,160, filed on Jun. 11, 2021, granted, now 11,783,469.
Application 17/346,160 is a continuation of application No. 16/285,765, filed on Feb. 26, 2019, granted, now 11,037,289, issued on Jun. 15, 2021.
Claims priority of provisional application 62/751,047, filed on Oct. 26, 2018.
Prior Publication US 2023/0386013 A1, Nov. 30, 2023
Int. Cl. G06T 7/70 (2017.01); G06T 7/00 (2017.01)
CPC G06T 7/0006 (2013.01) [G06T 7/70 (2017.01); G06T 2207/10061 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30204 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a wafer;
capturing a defect image of part of the wafer;
determining a first design pattern image based on a design pattern data;
overlapping the defect image with part of the first design pattern image;
determining a clipped image of the first design pattern image when matched pixels between the clipped image and the defect image are calculated as a maximum number;
generating a first reference image corresponding to the defect image based on the clipped image and a reference image generation model; and
generating a first defect marked image based on the defect image and the first reference image.