US 12,242,910 B2
Method for producing a chip card, card body for a chip card, and chip card
Michael Baldischweiler, Munich (DE)
Assigned to GIESECKE+DEVRIENT EPAYMENTS GMBH, Munich (DE)
Appl. No. 18/263,999
Filed by GIESECKE+DEVRIENT EPAYMENTS GMBH, Munich (DE)
PCT Filed Feb. 2, 2022, PCT No. PCT/EP2022/025034
§ 371(c)(1), (2) Date Aug. 2, 2023,
PCT Pub. No. WO2022/167150, PCT Pub. Date Aug. 11, 2022.
Claims priority of application No. 10 2021 000 556.2 (DE), filed on Feb. 3, 2021.
Prior Publication US 2024/0127023 A1, Apr. 18, 2024
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07749 (2013.01) [G06K 19/07745 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for producing a chip card, the chip card comprising a card body and a chip module arranged thereon, having the steps:
providing a card body;
excavating a cavity in order to receive the chip module;
excavating at least one component opening respectively for one or more power matching components in an overlap region and in a bottom face of the cavity such that the at least one component opening is covered by the subsequently arranged chip module, wherein the respective power matching component is a capacitor;
applying solder onto the power matching component or components, into the at least one component opening and/or a lower side of the chip module;
placing the power matching component or components in the at least one component opening;
introducing the chip module into the cavity; and
heating the solder.