US 12,242,315 B2
Thermal management in horizontally or vertically stacked dies
Somvir Singh Dahiya, Bengaluru (IN); Stephen Gunther, Beaverton, OR (US); Julien Sebot, Portland, OR (US); Randy Osborne, Beaverton, OR (US); Scot Kellar, Bend, OR (US); and Joshua Een, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 16, 2021, as Appl. No. 17/203,571.
Prior Publication US 2022/0300049 A1, Sep. 22, 2022
Int. Cl. G06F 1/32 (2019.01); G05B 6/02 (2006.01); G06F 1/20 (2006.01); G06F 1/3287 (2019.01); G06F 1/3203 (2019.01)
CPC G06F 1/206 (2013.01) [G05B 6/02 (2013.01); G06F 1/3287 (2013.01); G06F 1/3203 (2013.01)] 30 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first die; and
a second die, wherein the first die and the second die are in a stack of a multichip module, wherein the first die includes:
a plurality of thermal sensors including a first sensor and a second sensor, wherein the first sensor is to provide a first temperature of a first domain, wherein the second sensor is to provide a second temperature of a second domain; and
a power management unit to receive the first temperature and the second temperature, wherein the power management unit is to receive telemetry temperature data from one or more sensors of the second die, wherein the power management unit is to determine a virtual temperature of an IP domain of the first die in accordance with the first temperature, the second temperature, and the telemetry temperature data, wherein the virtual temperature is a predicted temperature for the IP domain based on the first temperature, second temperature, and the telemetry temperature data.