US 12,242,237 B2
Methods and mechanisms for generating a data collection plan for a semiconductor manufacturing system
William Kazmierski, Round Rock, TX (US); Joseph Blanco, Georgetown, TX (US); and Balaji Pasupathy, Chennai (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Dec. 17, 2021, as Appl. No. 17/554,428.
Prior Publication US 2023/0195071 A1, Jun. 22, 2023
Int. Cl. G05B 19/18 (2006.01); G05B 19/406 (2006.01)
CPC G05B 19/188 (2013.01) [G05B 19/406 (2013.01); G05B 2219/32128 (2013.01); G05B 2219/45031 (2013.01)] 22 Claims
OG exemplary drawing
 
13. A system, comprising:
a memory; and
a processing device operatively coupled with the memory, to perform operations comprising:
initiating a connection with a semiconductor manufacturing system;
generating a set of tool data items associated with the semiconductor manufacturing system;
providing a graphical user interface (GUI) presenting the set of tool data items associated with the semiconductor manufacturing system;
receiving, via the GUI, user input selecting one or more tool data items from the set of tool data items;
adding configuration data associated with the one or more tool data items to a data collection plan;
validating the configuration data to generate a modified data collection plan by:
locating, in the semiconductor manufacturing system, corresponding identification data indicative of whether a respective component of the semiconductor manufacturing system associated with respective configuration data is at least one of included in the semiconductor manufacturing system or is functional in the semiconductor manufacturing system; and
removing, from the data collection plan, a subset of the configuration data for which corresponding identification data was not located; and
executing one or more data collection operations at the semiconductor manufacturing system based on the modified data collection plan.