US 12,242,197 B2
Apparatus, system and method
Po-Han Wang, Hsinchu (TW); Yu-Hsiang Hu, Hsinchu (TW); Hung-Jui Kuo, Hsinchu (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 2, 2020, as Appl. No. 16/806,468.
Claims priority of provisional application 62/869,515, filed on Jul. 1, 2019.
Prior Publication US 2021/0003922 A1, Jan. 7, 2021
Int. Cl. G03F 7/00 (2006.01); G03F 7/38 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/38 (2013.01) [G03F 7/70908 (2013.01); H01L 21/0273 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a trench plate comprising a first surface and a second surface opposite the first surface, wherein the trench plate comprises a first trench extending partially through the trench plate from the first surface, wherein the trench plate also comprises a first opening extending fully through the trench plate from the first surface to the second surface, and a second opening extending fully through the trench plate from the first surface to the second surface, the first trench being located between the first opening and the second opening and the first opening and the second opening positioned adjacent to and separated from the first trench.