US 12,242,188 B2
Photosensitive resin composition for imprinting, cured article and optical element
Chin-Chen Huang, Taoyuan (TW); Yu-Lun Li, Taoyuan (TW); and Chen-Wen Chiu, Taoyuan (TW)
Assigned to eChem Solutions Corp., Taoyuan (TW)
Filed by eChem Solutions Corp., Taoyuan (TW)
Filed on Jan. 6, 2022, as Appl. No. 17/570,314.
Claims priority of application No. 110100745 (TW), filed on Jan. 8, 2021.
Prior Publication US 2022/0221789 A1, Jul. 14, 2022
Int. Cl. G03F 7/00 (2006.01); G03F 7/029 (2006.01); G03F 7/035 (2006.01)
CPC G03F 7/0005 (2013.01) [G03F 7/0002 (2013.01); G03F 7/029 (2013.01); G03F 7/035 (2013.01)] 16 Claims
 
1. A photosensitive resin composition for imprinting, comprising:
a resin (A), wherein the resin (A) has a weight average molecular weight of 1,000 to 50,000 and has two or more ethylenic polymerizable groups;
an ethylenically unsaturated monomer (B);
a photoinitiator (C), wherein the photoinitiator (C) is consisting essentially of an acylphosphine oxide compound (C-1);
a solvent (D); and
a hydrophobic oligomer (E),
wherein based on 100 parts by weight of the resin (A), the ethylenically unsaturated monomer (B) is 100 to 800 parts by weight, the acylphosphine oxide compound (C-1) is 10 to 30 parts by weight, the solvent (D) is 300 to 900 parts by weigh, and the hydrophobic oligomer (E) is 0.1 to 50 parts by weight.