US 12,242,185 B2
Curable composition, kit, interlayer, laminate, imprint pattern producing method, and method for manufacturing device
Naoya Shimoju, Haibara-gun (JP); and Akihiro Hakamata, Haibara-gun (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Aug. 18, 2022, as Appl. No. 17/890,374.
Application 17/890,374 is a continuation of application No. PCT/JP2021/006080, filed on Feb. 18, 2021.
Claims priority of application No. 2020-026864 (JP), filed on Feb. 20, 2020.
Prior Publication US 2023/0004079 A1, Jan. 5, 2023
Int. Cl. G03F 7/40 (2006.01); G03F 7/00 (2006.01); G03F 7/031 (2006.01)
CPC G03F 7/0002 (2013.01) [G03F 7/031 (2013.01); G03F 7/40 (2013.01)] 7 Claims
 
1. A curable composition used for forming an interlayer existing between a base material and a curable layer, the curable composition comprising:
a curable main agent having a polymerizable functional group;
a polymerization inhibitor, wherein the polymerization inhibitor includes at least one compound selected from the group consisting of a phenol-based compound, a quinone-based compound, a free radical-based compound, an amine-based compound, and a phosphine-based compound, and has a molecular weight of 1,000 or less; and
a solvent,
wherein a content of the polymerization inhibitor is 200 parts by mass or greater and lower than 1,000 parts by mass with respect to 1,000,000 parts by mass of the curable main agent.