	US 12,242,181 B2
	Photomask assembly and method of forming the same
Kuo-Hao Lee, Hsinchu (TW); Hsi-Cheng Hsu, Taichung (TW); Jui-Chun Weng, Taipei (TW); Han-Zong Pan, Hsinchu (TW); Hsin-Yu Chen, Hsinchu (TW); and You-Cheng Jhang, Changhua (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 31, 2023, as Appl. No. 18/362,046.
Application 18/362,046 is a continuation of application No. 17/813,165, filed on Jul. 18, 2022, granted, now 11,789,360.
Application 17/813,165 is a continuation of application No. 16/949,771, filed on Nov. 13, 2020, granted, now 11,392,024, issued on Jul. 19, 2022.
Prior Publication US 2023/0384664 A1, Nov. 30, 2023
Int. Cl. G03F 1/64 (2012.01); G03F 1/22 (2012.01); G03F 1/62 (2012.01)

CPC G03F 1/64 (2013.01) [G03F 1/22 (2013.01); G03F 1/62 (2013.01)]

20 Claims

1. An assembly, comprising:

a pellicle frame; and

a photomask frame secured to the pellicle frame without a first intervening buffer layer between the photomask frame and the pellicle frame.