US 12,242,123 B1
Photonic quantum computer assembly with a quantum computing die facing an electronic circuit die
Gabriel J. Mendoza, San Francisco, CA (US); Matteo Staffaroni, San Ramon, CA (US); Albert Wang, Sunnyvale, CA (US); John Eugene Berg, Palo Alto, CA (US); and Ramakanth Alapati, Dublin, CA (US)
Assigned to Psiquantum, Corp., Palo Alto, CA (US)
Filed by Psiquantum, Corp., Palo Alto, CA (US)
Filed on Dec. 21, 2023, as Appl. No. 18/392,124.
Application 17/951,916 is a division of application No. 16/576,626, filed on Sep. 19, 2019, granted, now 11,493,713, issued on Nov. 8, 2022.
Application 18/392,124 is a continuation of application No. 17/951,916, filed on Sep. 23, 2022, granted, now 11,892,693.
Claims priority of provisional application 62/733,482, filed on Sep. 19, 2018.
Int. Cl. G02B 6/43 (2006.01); G02B 6/12 (2006.01); G06N 10/00 (2022.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC G02B 6/43 (2013.01) [G02B 6/12002 (2013.01); G06N 10/00 (2019.01); H01L 24/47 (2013.01); H01L 25/0657 (2013.01); G02B 2006/12061 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device comprising:
a die stack including:
a first die including a quantum computing circuit; and
a second die including an electronic circuit, wherein the second die and the first die face each other; and
a coupler bonded to a first surface of the first die.