US 12,242,121 B2
Heat dissipation structure for optoelectronic module and electronic device
Xiaolong Lv, Fujian (CN); Wei Liu, Fujian (CN); and Guohong Lai, Fujian (CN)
Assigned to Ruijie Networks Co., Ltd., Fuzhou (CN)
Filed by Ruijie Networks Co., Ltd., Fuzhou (CN)
Filed on Jun. 5, 2024, as Appl. No. 18/734,054.
Application 18/734,054 is a continuation of application No. PCT/CN2023/116294, filed on Aug. 31, 2023.
Claims priority of application No. 202211052270.8 (CN), filed on Aug. 31, 2022.
Prior Publication US 2024/0319456 A1, Sep. 26, 2024
Int. Cl. G02B 6/42 (2006.01); H05K 7/20 (2006.01)
CPC G02B 6/4268 (2013.01) [H05K 7/20336 (2013.01); H05K 7/20509 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A heat dissipation structure for an optoelectronic module, comprising:
an electronic chip;
a plurality of optical engines, distributed along a periphery of the electronic chip; and
a cold plate, comprising:
a main cold plate for dissipating heat for the electronic chip;
a secondary cold plate for dissipating heat for at least one of the plurality of optical engines; and
a heat pipe assembly corresponding to the secondary cold plate, the heat pipe assembly comprising at least one heat pipe, wherein the at least one heat pipe has an evaporating end connected to the secondary cold plate, and a condensing end connected to the main cold plate;
wherein the main cold plate is provided with a flow channel for dissipating heat for the heat pipe assembly, and
the secondary cold plate has a maintenance operation position, wherein when the secondary cold plate is in the maintenance operation position, there is an operational space between the secondary cold plate and the corresponding optical engine for maintaining the corresponding optical engine.