US 12,242,120 B2
Optoelectronic module, optoelectronic plug connector and optoelectronic sub-distribution unit
Andreas Schwarz, Bünde (DE); Rainer Bussmann, Bad Essen (DE); and Marc Genau, Lübbecke (DE)
Assigned to HARTING Electronics GmbH, Espelkamp (DE)
Appl. No. 18/019,836
Filed by HARTING Electronics GmbH, Espelkamp (DE)
PCT Filed Aug. 19, 2021, PCT No. PCT/DE2021/100701
§ 371(c)(1), (2) Date Feb. 6, 2023,
PCT Pub. No. WO2022/053104, PCT Pub. Date Mar. 17, 2022.
Claims priority of application No. 10 2020 123 465.1 (DE), filed on Sep. 9, 2020.
Prior Publication US 2023/0280552 A1, Sep. 7, 2023
Int. Cl. H04B 10/00 (2013.01); G02B 6/42 (2006.01)
CPC G02B 6/426 (2013.01) [G02B 6/428 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An optoelectronic module (1), comprising:
multiple optoelectronic transducers (2, 2′), having
a transducer housing (20) with internal transducer electronics arranged therein,
electrical connections (21, 21′), which are connected to the internal transducer electronics in an electrically conductive manner and project out of the transducer housing (20), and
an optical connection (22), which is arranged in the transducer housing (20) and may receive and/or emit light through a window in a housing wall of the transducer housing (20); and
a module housing (100) for accommodating and collectively fastening the optoelectronic transducers (20) on a printed circuit board (4) and for connecting optical conductors (51) to the optical connections (22) of the transducers (2) and for strain-relieving the optical conductors, wherein
the module housing (100) is constructed in at least two parts and has
a housing upper part (11) and
a housing lower part (12), which can be connected and secured to said housing upper part, wherein
a lower end of the housing lower part (12) is configured for fastening the housing lower part (12) on the printed circuit board (4), and wherein
a respective transducer chamber (120) is arranged in the housing lower part (12) for accommodating each optoelectronic transducer (2) to be accommodated in a form-fitting manner, the respective transducer chambers (120) having one or more contact lead-through openings (125) at the lower end of the housing lower part (12) in order for the electrical connections (21, 21′) of the optoelectronic transducer (20) to pass through and make electrical contact with the printed circuit board (4), and wherein
the housing upper part (11) and the housing lower part (12) each have part of a cable channel (118, 128) at their common contact surfaces (114) in each case, whereby
a complete cable channel (18) is formed in each case for feeding optical conductors (51) to the transducer chambers (120), and therefore to the respective optoelectronic transducers (2) arranged therein, after the housing upper part (11) and housing lower part (12) have been joined together,
wherein the multiple optoelectronic transducers (2, 2′) include at least one upper optoelectronic transducer (2) and at least one lower optoelectronic transducer (2′),
wherein the optical connection (22) of the at least one upper optoelectronic transducer (2) is arranged in an upper plane and the optical connection (22′) of the at least one lower optoelectronic transducer (2′) is arranged in a lower plane, and
wherein the upper plane is arranged at a greater distance from the lower end of the housing lower part (12) than the lower plane.