| CPC G02B 6/1225 (2013.01) [G02B 6/12019 (2013.01); G02B 2006/1213 (2013.01)] | 20 Claims |
|
1. A method, comprising:
forming a first package comprising:
forming a first silicon waveguide comprising a plurality of photonic components, the plurality of photonic components comprising a first grating coupler;
forming an interconnect structure over the first silicon waveguide; and
bonding a semiconductor die to the interconnect structure, wherein the semiconductor die is electrically connected to the interconnect structure, the interconnect structure being between the first silicon waveguide and the semiconductor die;
attaching the first package to an interconnect substrate; and
attaching a photonic routing structure to the first package, wherein the photonic routing structure comprises a second silicon waveguide comprising a second grating coupler, wherein the second grating coupler is optically coupled to the first grating coupler of the first package, the first package being between the photonic routing structure and the interconnect substrate.
|