| CPC G02B 6/0076 (2013.01) [G02B 6/0073 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01)] | 7 Claims |
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1. A multi-layer optical interconnect for integrated circuits, comprising:
a first transceiver array, the first transceiver array having a first plurality of microLEDs and a first plurality of photodetectors, the first plurality of microLEDs being mounted to a first substrate, the first plurality of photodetectors being in or mounted to the first substrate;
a second transceiver array, the second transceiver array having a second plurality of microLEDs and a second plurality of photodetectors, the second plurality of microLEDs being mounted to a second substrate, the second plurality of photodetectors being in or mounted to the second substrate; and
a multi-layer planar waveguide coupling light from the first plurality of microLEDs with the second plurality of photodetectors and coupling light from the second plurality of microLEDs with the first plurality of photodetectors, the multi-layer planar waveguide including a plurality of vertical waveguide layers optically coupled to a plurality of horizontal waveguide layers; and
wherein the plurality of horizontal waveguide layers are part of a modular assembly separate from the plurality of vertical waveguide layers of the multi-layer planar waveguide.
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