US 12,242,080 B2
Laser processing device, and laser processing method
Yotaro Wani, Hamamatsu (JP); and Yasunori Igasaki, Hamamatsu (JP)
Assigned to HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Appl. No. 17/779,300
Filed by HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
PCT Filed Nov. 20, 2020, PCT No. PCT/JP2020/043465
§ 371(c)(1), (2) Date May 24, 2022,
PCT Pub. No. WO2021/106801, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 2019-214337 (JP), filed on Nov. 27, 2019.
Prior Publication US 2022/0390757 A1, Dec. 8, 2022
Int. Cl. B23K 26/04 (2014.01); B23K 26/00 (2014.01); B23K 26/046 (2014.01); B23K 26/10 (2006.01); B23K 26/53 (2014.01); G02B 5/30 (2006.01); G02B 27/09 (2006.01); G02B 27/28 (2006.01); G02F 1/01 (2006.01); H01L 21/304 (2006.01); H01L 21/78 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01)
CPC G02B 27/286 (2013.01) [B23K 26/0006 (2013.01); B23K 26/046 (2013.01); B23K 26/53 (2015.10); G02B 5/3025 (2013.01); G02B 27/0927 (2013.01); G02B 27/283 (2013.01); G02F 1/0136 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); B29C 2791/009 (2013.01)] 3 Claims
OG exemplary drawing
 
3. A laser processing method in which laser processing is performed on a semiconductor object made of a birefringent material, by irradiating the semiconductor object with laser light, the method comprising:
a step of placing the semiconductor object on a stage;
a step of setting a polarized light component control unit configured to control polarized light components of the laser light such that the laser light is focused on one point in the semiconductor object in an optical axis direction; and
a step of outputting the laser light, wherein
in the step of outputting the laser light, the laser light that is linearly polarized light is output, and
in the step of setting the polarized light component control unit, a conversion element configured to convert the linearly polarized light into radially polarized light or azimuthally polarized light is disposed on an optical path.