| CPC G01R 31/2874 (2013.01) [G01K 3/005 (2013.01); G01K 3/08 (2013.01); G01R 1/07342 (2013.01)] | 12 Claims |
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1. A wafer test system comprising:
a chuck for supporting a wafer including a plurality of dies;
a probe head for inputting a test signal for an electrical test to a probe card and receiving an electrical test result corresponding to the test signal;
the probe card for inputting test signals to the dies through a plurality of pins and receiving test results;
a sensing device mounted on a surface of the probe card, for sensing an active state occurring in the wafer when the electrical test is performed; and
a determination unit for receiving the electrical test result and an active state information for the dies and determining whether each of the dies has failed using the result of the electrical test on the wafer and the active state information,
wherein the determination unit stops the electrical test based on the active state information of the plurality of dies,
wherein the active state information is an average temperature of the plurality of dies included in the wafer that is lower than a first threshold temperature or higher than a second threshold temperature, where the second threshold temperature is higher than the first threshold temperature, or
wherein the active state information is a difference between a maximum temperature and a minimum temperature from among temperatures of the plurality of dies included in the wafer that is equal to or higher than a threshold value.
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