US 12,241,914 B2
Current sensing device
Miyahito Kinoshita, Nagano (JP)
Assigned to KOA Corporation, Nagano (JP)
Appl. No. 17/910,253
Filed by KOA CORPORATION, Nagano (JP)
PCT Filed Dec. 28, 2020, PCT No. PCT/JP2020/049063
§ 371(c)(1), (2) Date Sep. 8, 2022,
PCT Pub. No. WO2021/181835, PCT Pub. Date Sep. 16, 2021.
Claims priority of application No. 2020-041006 (JP), filed on Mar. 10, 2020.
Prior Publication US 2023/0100174 A1, Mar. 30, 2023
Int. Cl. G01R 1/20 (2006.01); G01R 19/00 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01)
CPC G01R 1/203 (2013.01) [G01R 19/0092 (2013.01); H05K 1/115 (2013.01); H05K 1/167 (2013.01); H05K 3/4632 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A current sensing device comprising:
an insulating resin substrate made of a first insulating material, wherein the insulating resin substrate is formed with a hole inside of the insulating resin substrate;
a current sensing element arranged in the hole formed in the resin substrate;
a resin layer made of a second insulating material different from the first insulating material, wherein the resin layer covers the insulating resin substrate in its entirety and secure the current sensing element to the insulating resin substrate;
a current wire provided through the resin layer in contact with the current sensing element to supply an electrical current to the current sensing element;
a plurality of current vias provided through the resin layer to connect the current sensing element and the current wire; and
a voltage sensing via connected to the current sensing element to measure a voltage drop that takes place through the current sensing element.